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Würth Elektronik Watts Up Podcast


Sep 30, 2021

The trend to miniaturize wireless communication devices has led to decreased PCB sizes and increased component densities. Although this shift to miniaturized technology has aided many areas of electronic design, it constrains RF front-end design. Multilayer chip antennas are an interesting choice for engineers, who are restricted by cost and space requirements in wireless system design. Low temperature co-fired ceramic (LTCC) multilayer chip antennas are formed from several layers of dielectric material, which are pressed and fired together into a monolithic structure.

Download the Application Note here.

Figure 1:

Design rules for WE-MCA Multilayer Chip Antenna corner placement

Figure 2:

Figure 3:

Example of a Smith Chart with conductance and susceptance lines (blue) and resistance and reactance lines (red)

Figure 4:

Complex Impedence plotted on a Smith Chart of the shorted and Partially Matched WE-MCA

Figure 5:

The effect of decreasing parallel inductance in the matching network of a WE-MCA chip antenna